Manufacturing Capabilites

Technology section

PCB and Assembly Capabilities

We understand some designs require advanced technologies. To increase the diversity we have structured our capabilities table in two columns: Standard Capabilities & Advanced Capabilities. This can help our customer determine which design strategy to follow.

Finished Board Thickness

This table represents the minimum and maximum thicknesses of the final circuit board and the each substrate layer.

Feature Standard Advanced
Double-Sided
Min. 0.032”
Min. 0.010″
Double-Sided
Max. 0.070”
Max. 0.250″
Multi-Layer
Min. 0.032″
Min. 0.018″
Multi-Layer
Max. 0.220″
to 0.250″
Min. Core Thickness
0.005″
0.004″
Finished Thickness ±
10%
7-10%
Cu Weight, Inner
Min. 1/2 oz.
Min. 1/4 oz.
Cu Weight, Inner
Max. 2.0 oz.
Max 4.0 oz.
Cu Weight, Outer
Min. 3/4 oz.
Min. 1/4 oz.
Cu Weight, Outer
Max. 2.0 oz.
Max 12.0 oz.

Base Material (Laminate)

This table represents the types of material offered to manufacturing the circuit board.

Feature Standard Advanced
Panel Size
18x16 & 18x24
18x16 & 18x24
Layer Count
0 to 8
10 to 30
Rigid Board
Yes
Yes
Flexible Circuit
No
Yes
Flexible Cover Lay
No
Yes
HDI
No
Yes
FR4 Tg140
Yes
Yes
FR4 Tg170
Yes
Yes
FR4 Tg180
Yes
Yes
Rogers High Frequency
No
Yes
Polyimide High Temperature
No
Yes
Aluminum Core
No
Yes

Design Geometries, Lines, Spaces, and Pad Sizes

This table represents the circuitry pattern etched on the circuit board.

Feature Standard Advanced
Outer Conductor Width
0.004 – .008″
0.0035 – .003″
Outer Conductor Spacing
0.004 – .008″
0.0035 – .003″
Inner Conductor Width
0.004 – .006″
0.0035 – .0025″
Inner Conductor Spacing
0.004 – .006″
0.0035 – .0025″
Inner Pad Size
0.005 – .007"
0.004 – .003″
Outer Pad Size
0.006 – .007"
0.004 – .003"
SMT Pad Pitch
0.018 – .014″
0.010 – .012″
Impedance
10%
7%
Hole Aspect Ratio
8 to 1
12 to 1

Note the minimum pattern geometries are based on standard copper weights up to 2.0 oz. Heavier copper may require conductor spacing to compensate for the etching factor.

Coating, Soldermask Resist and Silkscreen Legend

This table represents the types and limitations of solder resist and silkscreen markings coated over the circuit board.

Feature Standard Advanced
Soldermask Type
LPI
LPI
Soldermask Type
Peelable
Peelable
Min. Mask Clearance [LPI]
0.004″
0.003 – .002″
Soldermask Color
Green, Blue, Red, Black, White (LED)
Any Color
Soldermask Web Min
0.004 – .0035"
0.003 – .0025″
Legend Feature Size
0.008″ Wide x 0.032″ Tall
0.0035″ Wide x 0.022″ Tall
Legend Color
White, Black, Yellow
Any Color

Board Surface Finish and Treatments

This table represents the types of surface finishes treated over the outer circuit layers.

Feature Standard Advanced
Bare Copper
Yes
Yes
OSP / Entek
Yes
0.003"
White Tin
Yes
Yes
Tin/Lead Plating Thickness
Copper Coverage
0.003″
Carbon Ink
No
Yes
Immersion Gold (ENIG)
Yes
Yes
Immersion Silver
Yes
Yes
ENEIPG (palladium)
Yes
Yes
Electroless Nickel
Yes
Yes
Nickel Plating Thickness
120-150 Micro Inches
250 Micro Inches
Gold Plating Thickness
20-50 Micro Inches
As Specified

Tolerances

This table represents the tolerances we can offer outside of any standard deviation.

Feature Standard Advanced
Warp/Twist
0.75%
0.50%
Fabrication /Rout ±
0.010”
0.005”
Plated Hole ±
0.003″
0.003″
Non-Plated Hole ±
0.002″
0.002″
Hole Location ±
0.004"
0.002"
Drilled hole to copper
0.012”
0.010”
Hole to Board Edge
0.010"
0.005"
Layer to Layer ±
0.005"
0.003"

PCB Via and Hole Finish

This table represents the drill holes and related features.

Feature Standard Advanced
Min. Hole Size, Mechanical
0.0079”
0.0059”
Min. Hole Size, Laser
0.0049″
0.0029"
Slotted Drill
Min. 0.028″
Min. 0.020″
Blind/ Buried Vias
No
Yes
Via Under PAD
No
Yes
Stacked Vias
No
Yes
Castellation /Edge Plating
No
Yes
Tented Via LPI
No
Yes
Non-Conductive Via Fill
No
Yes
Conductive Via Fill
No
Yes
Copper Filled Via
No
Yes

Assembly Capabilities

Assembly SMT features and capabilities.

Feature Standard / Advanced
Turn Around Times
1-3 weeks, 24-72 Hrs
Soldering Types
Leaded, Lead-free RoHS
Stencils
Laser Cut
Quality Standards
IPC Class II / IPC Class III
Assembly Types
Surface Mount, Through-Hole, Mixed
Component Types
SMT 0201, BGA, MBGA 0.5mm, X-Ray
Other
Cable Harness, Box Build, Program & Test
Conformal Coating
Urethane, Acrylic, Epoxy., Silicon, Paraleyne
Circuit Types
Rigid, Flex Circuits

Assembly starts after all material received and through audit.