Technology section
We understand some designs require advanced technologies. To increase the diversity we have structured our capabilities table in two columns: Standard Capabilities & Advanced Capabilities. This can help our customer determine which design strategy to follow.
This table represents the minimum and maximum thicknesses of the final circuit board and the each substrate layer.
| Feature | Standard | Advanced |
|---|---|---|
|
Double-Sided |
Min. 0.032” |
Min. 0.010″ |
|
Double-Sided |
Max. 0.070” |
Max. 0.250″ |
|
Multi-Layer |
Min. 0.032″ |
Min. 0.018″ |
|
Multi-Layer |
Max. 0.220″ |
to 0.250″ |
|
Min. Core Thickness |
0.005″ |
0.004″ |
|
Finished Thickness ± |
10% |
7-10% |
|
Cu Weight, Inner |
Min. 1/2 oz. |
Min. 1/4 oz. |
|
Cu Weight, Inner |
Max. 2.0 oz. |
Max 4.0 oz. |
|
Cu Weight, Outer |
Min. 3/4 oz. |
Min. 1/4 oz. |
|
Cu Weight, Outer |
Max. 2.0 oz. |
Max 12.0 oz. |
This table represents the types of material offered to manufacturing the circuit board.
| Feature | Standard | Advanced |
|---|---|---|
|
Panel Size |
18x16 & 18x24 |
18x16 & 18x24 |
|
Layer Count |
0 to 8 |
10 to 30 |
|
Rigid Board |
Yes |
Yes |
|
Flexible Circuit |
No |
Yes |
|
Flexible Cover Lay |
No |
Yes |
|
HDI |
No |
Yes |
|
FR4 Tg140 |
Yes |
Yes |
|
FR4 Tg170 |
Yes |
Yes |
|
FR4 Tg180 |
Yes |
Yes |
|
Rogers High Frequency |
No |
Yes |
|
Polyimide High Temperature |
No |
Yes |
|
Aluminum Core |
No |
Yes |
This table represents the circuitry pattern etched on the circuit board.
| Feature | Standard | Advanced |
|---|---|---|
|
Outer Conductor Width |
0.004 – .008″ |
0.0035 – .003″ |
|
Outer Conductor Spacing |
0.004 – .008″ |
0.0035 – .003″ |
|
Inner Conductor Width |
0.004 – .006″ |
0.0035 – .0025″ |
|
Inner Conductor Spacing |
0.004 – .006″ |
0.0035 – .0025″ |
|
Inner Pad Size |
0.005 – .007" |
0.004 – .003″ |
|
Outer Pad Size |
0.006 – .007" |
0.004 – .003" |
|
SMT Pad Pitch |
0.018 – .014″ |
0.010 – .012″ |
|
Impedance |
10% |
7% |
|
Hole Aspect Ratio |
8 to 1 |
12 to 1 |
Note the minimum pattern geometries are based on standard copper weights up to 2.0 oz. Heavier copper may require conductor spacing to compensate for the etching factor.
This table represents the types and limitations of solder resist and silkscreen markings coated over the circuit board.
| Feature | Standard | Advanced |
|---|---|---|
|
Soldermask Type |
LPI |
LPI |
|
Soldermask Type |
Peelable |
Peelable |
|
Min. Mask Clearance [LPI] |
0.004″ |
0.003 – .002″ |
|
Soldermask Color |
Green, Blue, Red, Black, White (LED) |
Any Color |
|
Soldermask Web Min |
0.004 – .0035" |
0.003 – .0025″ |
|
Legend Feature Size |
0.008″ Wide x 0.032″ Tall |
0.0035″ Wide x 0.022″ Tall |
|
Legend Color |
White, Black, Yellow |
Any Color |
This table represents the types of surface finishes treated over the outer circuit layers.
| Feature | Standard | Advanced |
|---|---|---|
|
Bare Copper |
Yes |
Yes |
|
OSP / Entek |
Yes |
0.003" |
|
White Tin |
Yes |
Yes |
|
Tin/Lead Plating Thickness |
Copper Coverage |
0.003″ |
|
Carbon Ink |
No |
Yes |
|
Immersion Gold (ENIG) |
Yes |
Yes |
|
Immersion Silver |
Yes |
Yes |
|
ENEIPG (palladium) |
Yes |
Yes |
|
Electroless Nickel |
Yes |
Yes |
|
Nickel Plating Thickness |
120-150 Micro Inches |
250 Micro Inches |
|
Gold Plating Thickness |
20-50 Micro Inches |
As Specified |
This table represents the tolerances we can offer outside of any standard deviation.
| Feature | Standard | Advanced |
|---|---|---|
|
Warp/Twist |
0.75% |
0.50% |
|
Fabrication /Rout ± |
0.010” |
0.005” |
|
Plated Hole ± |
0.003″ |
0.003″ |
|
Non-Plated Hole ± |
0.002″ |
0.002″ |
|
Hole Location ± |
0.004" |
0.002" |
|
Drilled hole to copper |
0.012” |
0.010” |
|
Hole to Board Edge |
0.010" |
0.005" |
|
Layer to Layer ± |
0.005" |
0.003" |
This table represents the drill holes and related features.
| Feature | Standard | Advanced |
|---|---|---|
|
Min. Hole Size, Mechanical |
0.0079” |
0.0059” |
|
Min. Hole Size, Laser |
0.0049″ |
0.0029" |
|
Slotted Drill |
Min. 0.028″ |
Min. 0.020″ |
|
Blind/ Buried Vias |
No |
Yes |
|
Via Under PAD |
No |
Yes |
|
Stacked Vias |
No |
Yes |
|
Castellation /Edge Plating |
No |
Yes |
|
Tented Via LPI |
No |
Yes |
|
Non-Conductive Via Fill |
No |
Yes |
|
Conductive Via Fill |
No |
Yes |
|
Copper Filled Via |
No |
Yes |
Assembly SMT features and capabilities.
| Feature | Standard / Advanced |
|---|---|
|
Turn Around Times |
1-3 weeks, 24-72 Hrs |
|
Soldering Types |
Leaded, Lead-free RoHS |
|
Stencils |
Laser Cut |
|
Quality Standards |
IPC Class II / IPC Class III |
|
Assembly Types |
Surface Mount, Through-Hole, Mixed |
|
Component Types |
SMT 0201, BGA, MBGA 0.5mm, X-Ray |
|
Other |
Cable Harness, Box Build, Program & Test |
|
Conformal Coating |
Urethane, Acrylic, Epoxy., Silicon, Paraleyne |
|
Circuit Types |
Rigid, Flex Circuits |
Assembly starts after all material received and through audit.