Services we Provide

Board Layout

Starting a new project or need help with an existing PC board design? We take your wiring schematic, place your components, and rout the wires using the latest design tools and technologies.

We have seasoned designers and EE’s ready to work on your design. Schematic capture, library parts creation, mixed technologies including controlled impedance and matched lengths come standard practice.

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Blank Circuit Boards

We supply prototype to high density circuit board solutions. Flexible & Rigid-Flex technologies, micro-vias, up to 30 circuit layers.

Bare boards follow IPC manufacturing and qulaity standards and are 100% Netlist tested against the original CAD files post circuit board manufacturing

CAM edits and reverse engineering available.

PCB Assembly

Automated SMT circuit board assembly and through-hole technologies. Lead-free assembly processing, BGA X-ray, and fine pitch placement. Wire harnessing and conformal coating, no-clean and ESD controlled environment.

We can program and test your device before or post enclosure box building.

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F.A.Q.

Some common questions about circuit boards and assembly.

Surface Mount Technology (SMT) is the process of placing components using an automatic ‘Pick and Place’ machine during the assembly process. SMD or, Surface Mount Device, refers to the physical type of component that does not use through-hole leads. 

RoHS is a EU compliance, which stand for Restriction of Hazardous Substances, and does not contain the 10 banned substances: Cadmium (Cd); Lead (Pb); Mercury (Hg); Hexavalent Chromium (Cr VI); Polybrominated Biphenyls (PBB); Polybrominated Diphenyl Ethers (PBDE); Bis (2-Ethylhexyl) phthalate (DEHP); Benzyl butyl phthalate (BBP); Dibutyl phthalate (DBP); and Diisobutyl phthalate (DIBP).

The assembly panel, or array, consists of a matrix, or grid, of the circuit board repeated on panel. This allows the assembly process to place components on multiple boards at the same time.

Laser drilling typically cost more than mechanical drilled holes and is used when the hole diameter is <0.006″.

Laser drilling typically cost more than mechanical drilled holes and is used when the hole dimeter is <0.006″.

Laser drilling typically cost more than mechanical drilled holes and is used when the hole dimeter is <0.006″.

A Blind Via is a conductive surface hole that connects an outer layer with an inner layer of a multilayer PWB without penetrating the entire board. Where as a Buried Via is a conductive surface hole that connects one inner layer to another inner layer of a multilayer PWB without having a direct connection to either the top or bottom surface layer.

A process for making multilayer PWBs in which already finished multilayer’s are laminated together to form a higher-layer-count final board, or in which additional outer layers are added to finished multilayer PWBs.

Visit our glossary for more industry definitions.