Quality Standards and Assurances

Quality is standard protocol at CBS Electronics. We review and monitor all our steps and processes to make sure the final product and delivery is sound from start to finish. Keeping our customers satisfied and confidant is our number one priority.

The CBS Quality Assurance Program. This quality program is designed to control our internal documentation. Documentation control includes our standard operating procedures (SOP), work orders, client and customer data, supplier data, and our quality reports which include certificates and statements.

Quality Documents

Each custom order comes with our quality packet signed off by our inspectors. Quality packet typically includes, Certificate of Conformance (CoC), RoHS/Lead-free Statement (if applicable), Electrical Test Certificate, First Article (FA), Micro-section Analysis, TDR Impedance samples, Solder Sample, and other documents such as materials certifications.


ESD Packaging

All assemblies delivered in ESD sounds packaging as standard. Antistatic is also achieved by shipping in vacuum sealed bags using desiccant with humidity strips often used for PCBAs.

Quality Reassurance

  • IPC net list compare prior to PC board manufacturing: Checks IPC net list to gerber and N.C. drill data for any discrepancies
  • Pre-CAM front end DRC (design rule check): Checks customer design errors
  • Controlled impedance testing –TDR test of panel coupons
  • 100% net list test on all products

IPC Standards

CBS Electronics products and services follow the IPC Standards and Guidelines for PC Board Layout, PC Board Manufacturing, and PC Board Assembly:

  • IPC-2221/2222 Standard on Printed Board Design
  • IPC-A-600 Class 2 and Class 3 Acceptability of Printed Boards
  • IPC-6011 and IPC-6012 Qualification and Performance Specification for Rigid PCBs
  • IPC-4101 Specifications for Base Materials for Rigid and Multilayer PCBs
  • IPC-A-610 PC Assembly Acceptance Standard
  • IPC J-STD-003 Solderability Tests for Printed Boards

RoHS/WEEE Compliant

CBS offers lead-free assembly processing and lead-free PC board finishes by standard. Materials are WEEE compliant and free of the banned substances.

It is important your boards are manufactured using the proper materials and process profiles when using high temperatures during assembly. CBS provides the necessary materials and knowledge to ensure you receive a stable RoHS product.



Some common facts about circuit boards and assembly.

Surface Mount Technology (SMT) is the process of placing components using an automatic ‘Pick and Place’ machine during the assembly process. SMD or, Surface Mount Device, refers to the physical type of component that does not use through-hole leads. 

RoHS is a EU compliance, which stand for Restriction of Hazardous Substances, and does not contain the 10 banned substances: Cadmium (Cd); Lead (Pb); Mercury (Hg); Hexavalent Chromium (Cr VI); Polybrominated Biphenyls (PBB); Polybrominated Diphenyl Ethers (PBDE); Bis (2-Ethylhexyl) phthalate (DEHP); Benzyl butyl phthalate (BBP); Dibutyl phthalate (DBP); and Diisobutyl phthalate (DIBP).

The assembly panel, or array, consists of a matrix, or grid, of the circuit board repeated on panel. This allows the assembly process to place components on multiple boards at the same time.

Laser drilling typically cost more than mechanical drilled holes and is used when the hole diameter is <0.006″.

Laser drilling typically cost more than mechanical drilled holes and is used when the hole dimeter is <0.006″.

Laser drilling typically cost more than mechanical drilled holes and is used when the hole dimeter is <0.006″.

A Blind Via is a conductive surface hole that connects an outer layer with an inner layer of a multilayer PWB without penetrating the entire board. Where as a Buried Via is a conductive surface hole that connects one inner layer to another inner layer of a multilayer PWB without having a direct connection to either the top or bottom surface layer.

A process for making multilayer PWBs in which already finished multilayer’s are laminated together to form a higher-layer-count final board, or in which additional outer layers are added to finished multilayer PWBs.

Visit our glossary for more industry terms.